摘要
讨论了BGA器件焊接的特点,并对BGA器件焊接过程中产生的缺陷进行了阐述,采用X-射线检测仪检测了BGA封装器件安装焊点的几种常见缺陷,分析、阐述了其图像与相应缺陷的关系,结果表明X-射线检测方法能够准确地检测出BGA封装器件安装中的各种焊点缺陷,并能够自动计算BGA封装器件安装焊点的空洞率,对空洞缺陷的快速检测和预防具有实际意义。
The soldering characteristics of BGA component are discussed and the defects which occur in the BGA component soldering process are summarized. X - ray detection is used to examine several kinds of common defects of the BGA component soldered joints, the relations between its image and the corresponding defect are also elaborated. The results show X - ray examination method can accurately examine every kind of defects in the BGA component soldered joints and can automatically calculate the void percent in the BGA component soldered joints, which has a practical significance to the fast examination and the prevention of the void.
出处
《电子工艺技术》
2005年第6期340-343,348,共5页
Electronics Process Technology
