基于LTCC技术的三维集成微波组件

Three Dimensional Integrated Microwave Modules Based on LTCC Technology

低温共烧陶瓷(LTCC)技术和三维立体组装技术是实现微波组件小型化、轻量化、高性能和高可靠的有效手段.本文研究实现了基于LTCC技术的三维集成微波组件,对三维集成微波组件的立体互连结构、三维集成LTCC微波电路的垂直微波互连、微波多芯片模块(MMCM)的垂直微波互连等关键技术进行了重点阐述.研制出的三维集成微波组件的体积和重量分别比传统的二维平面LTCC集成微波组件减小40%和38%,电气性能相当.

Low temperature co-fired ceramics （LTCC） technology and three dimensional （3D） microwave cubic packaging technology for microwave modules are effective methods for realizing microwave modules miniature and light with high performance and high reliability. In this paper, 3D integrated microwave modules based on LTCC are studied and developed. The cubic interconnecting structure of 3D integrated microwave modules, the vertical microwave interconnecting of 3D integrated LTCC microwave circuit sub- strates, and the vertical microwave interconnecting of microwave multi-chip module （MMCM） are described in detail. The volume and weight of 3D integrated microwave modules with these technologies are reduced by 40% and 38 % respectively compared to traditional 2D LTCC integrated microwave modules,and the electric performances are about the same.