低模量硫化硅橡胶粘接研究

Study on bonding of low modulus cured silicone rubber

采用sol-gel工艺自制的S iO2补强增韧环氧树脂作为胶粘剂,对低模量硫化硅橡胶与金属或复合材料进行粘接试验,分析胶粘剂中S iO2理论含量及粘接工艺对粘接性能的影响,并把硫化硅橡胶放在改性环氧树脂中进行溶胀试验,探索胶粘剂对硅橡胶的粘接机理。结果表明,随着S iO2先驱体-有机硅烷含量的增加,硅橡胶的溶胀程度提高。改性环氧树脂胶粘剂能浸入硅橡胶的表层,对硅橡胶具有良好的亲和力。用该胶粘剂对硅橡胶与金属或复合材料进行粘接时,取得了良好的粘接效果。

Cured silicone rubber whose surface is extremely hydrophobic has low adhesion strength with other materials. In this paper, the adhesive tests were tried between low modulus cured silicone rubbers with metal or composite material by using SiO2/epoxy resin, which composed by sol-gel process. The influence of SiO2 content and the bonding process on the adhesion property were studied. In the swelling test of silicone rubber with the epoxy resin containing silane alkoxides, the degree of swelling increased with increasing SiO2 content. The high adhesion strength observed, the result was caused by the immersion of the Si02/epoxy resin adhesive into the surface layer of silicone rubber substrate and was attributed to the good affinity between SiO2/epoxy resin and the silicone rubber.