摘要
介绍了两大类硅膜的制备方法:物理方法与化学方法,其中包括物理方法中的电子束物理气相沉积技术(EB-PVD),目前该技术在国内应用比较少,所以对其工作原理、薄膜质量的影响因素等作了重点介绍。此外还介绍了磁控溅射法、化学气相沉积法、等离子体增强化学气相沉积、热丝化学气相沉积法等硅膜制备方法的基本原理及特点,并对它们的优缺点进行了比较。
Two categories of preparation technologies of silicon coating, which are physical and chemical ones, are introduced in this article. Being seldom used in preparing the silicon coating, the technology of electronic beam physical vapor deposition(EB-PVD)is introduced as a emphases, and the principium and influential factors to performances of silicon coating are the main part of the paper, At the same time, the mechanisms of magnetron sputtering, chemical vapor deposition(CVD), plasma enhanced chemical vapor deposition(PE-CVD), hot-wire chemical va- por deposition(HW-CVD)are introduced simply, and their advantages and the disadvantage are compared.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第12期84-86,共3页
Materials Reports
基金
国家自然科学基金(项目批准号:90205034)
关键词
硅膜制备
物理气相沉积
EB-PVD
化学气相沉积
preparation of silicon coating, physical vapor deposition, EB-PVD,chemical vapor deposition