摘要
采用钎料改性工艺制备了Sn-3．5Ag0．6Cu合金，用润湿平衡法测试了液态Sn-3．5Ag0．6Cu钎料在铜基体表面的润湿性，研究了钎料制备工艺、钎剂卤素含量、浸溃温度和时间等因素对润湿性能的影响。结果表明：采用改性工艺可增强钎料的湿性能，当钎剂卤素含量为0．4wt％、在270℃下浸渍2-3s时，液态Sn-3．5Ag0．6Cu钎料对铜表面的润湿性可以达到最佳状态。指出降低钎料的熔点和液态表面张力是提高润湿性的关键。
Sn-3.5Ag 0. 6Cu alloy is prepared with the solder modified technique. The wettability of liquid solder Sn3. 5Ag0. 6Cu on the surface of copper is tested with the wetting balance method. Some factors are studied that affect the wettability,such as the preparation technique of solder,Cl^- content in flux,the soaking temperature and time. The results indicates that the solder modified technique improves the wettability of alloy Sn-3. SAg 0. 6Cu The wettability of liquid alloy on the surface of copper will improve to high-point if the Cl^ - content in flux is about 0. 4wt%, the soaking temperature is about 270℃and the time stays at about 2 -3s. Obviously,the key to improve the wettability is to reduce the surface tension of liquid and decrease the melting point of solder.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第F05期302-304,共3页
Materials Reports
