氢化锆表面电镀Cr-C氢渗透阻挡层分析

Study on Hydrogen Barrier of Cr-C Alloy Fabricated by Electroplating upon Zirconium Hydride

用电镀法在氢化锆表面生成致密的Cr-C合金层,经过700℃、144h保温后,基体中氢化锆晶体结构仍然为电镀和加热前的ZrH_(1.801),说明该镀层能够有效地阻挡氢的析出。XPS和SEM分析结果证明,镀层由cr和c组成；其中存在O-H键和可能存在C-H键。这两种键的存在说明,氢被阻挡的原因可能是氢在渗透过程中被镀层中的O和C所捕获。

A chromium-carbon alloy film on a surface of zirconium hydride sample was fabricated by electroplating, and zirconium hydride sample with Cr-C alloy film was heated at 700℃ for 144 hours. The test results for microstructure of zirconium hydride with XRD indicated that zirconium hydride had the same microstructure of ZrH1.801 as what it had before electroplating and heating. It means that the film could be a hydrogen permeation barrier on the zirconium hydride. The composition and microstructure of film were analyzed with XPS and SEM. The results showed that the film was formed with Cr and C, and some O-H chemical bonding exist in the film and some C-H chemical bonding are able to exist in the film. It is believed that the existence of the two chemical bonding is the origin for the formation of hydrogen permeation barrier.