无铅化PCB及其对CCL基材的要求

The Lead-free PCB and It's Requirement of CCL Basic Materials

概述了无铅化PCB的提出、要求和解决方法。着重指出:无铅化PCB的实质是提高与解决PCB耐热的可靠性问题,解决这个问题,最重要的是通过提高CCL基材中树脂的热分解温度、并与PCB工艺、焊料与焊接技术等多方面的方法,才能较全面的加以解决。

This article introduces the challenges,requirements and implemental methods of lead-free PCB.The paper stresses that the essential of lead-free PCB is to improve the thermal resistance of PCB to solve the reliability problem.To cope with the challenges of lead-flee,the most important issure is to increase the thermal decomposition temperature of resin in copper clad laminate and in the meantime,to take the process techniques,solder materials and soldertechnologies etc into consideration.