摘要
概述了在微细线路形成中湿式镀工艺的新开发,可以在改性聚酰亚胺膜上形成微细线路图形。
This paper describes new development of wet plating process in micro fine circuit formation.It can form micro fine circuit pattem on improved performance polyimide film.
出处
《印制电路信息》
2005年第12期34-37,共4页
Printed Circuit Information
关键词
湿式镀工艺
改性聚酰亚胺
纳米粒子
微细线路图形
wet plating process improved performance polyimide nanon particle micro fine circuit pattern
