摘要
介绍了什么是不流动(低流动度)半固化片,以及在PCB行业中的主要应用,特别介绍了在加工挠性板和冷板的工艺注意事项。并通过丰富的图示,介绍了其测试方法,通过玻璃转化温度,导热特性等多方面介绍了不流动(低流动度)半固化片的选择方法。
With this article,Low-flow prepreg is introduced in this article,and the application in Rigid-flex and heatsink,with data and graphic,test method of no-flow pp and process issues are introduced here.This article also gives you a guidance of how to choose No-riow.
出处
《印制电路信息》
2005年第12期52-54,共3页
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