铝基复合材料的瞬间液相扩散连接试验

Transient liquid-phase bonding of aluminum metal matrix composites

分别采用Cu箔和Cu膜作为中间层,在853 K保温情况下进行了S iC颗粒增强铝基复合材料的瞬间液相扩散连接试验.用金相显微镜、扫描电镜、能谱仪、X射线衍射仪和拉伸试验机研究了表面状态、保温时间和压力对接头显微组织和性能的影响.结果表明:合适的压力和中间层厚度能有效改善接头的组织和力学性能,接头剪切强度随保温时间延长而提高.表面状态对接头强度有较大影响.采用Cu膜作中间层由于没有氧化膜的影响,可以获得更好的接头性能,在加2 M Pa压力,853 K保温120 m in连接时接头剪切强度可达169.1 M Pa,约为母材强度的81.7%.

Transient liquid-phase bonding of SiCp/MMCs with Cu foil and Cu film as interlayer at 853 K were studied. The effect of surface status, bolding time and pressure on bonding microstructure and properties were also estimated by metallography microscope, SEM, EDS, XRD and tensile testing machine. The results show that proper pressure and interlayer thickness can evidently improve the microstructure and mechanical properties, and the shear strength of joint is increased with the holding time. The surface morphology has a great effect on the strength of joint. Better properties can be obtained with Cu film as interlayer, when bonding at 853 K for 120 min under 2 Mpa pressure, the shear strength of bonded joints can obtain 169.1 Mpa, about 81.7 percentage of the strength of base material.