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无铅回流焊冷却速率研究应用现状

The Researches of Cooling Rate in Lead-free Reflow Soldering
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摘要 阐述了冷却速率对无铅再流焊质量影响的研究现状,总结了冷速对无铅钎料以及SMT 焊点可靠性的影响。研究现状表明快速冷却有助于减少焊接缺陷,提高焊点可靠性。 This article introduces the researches of the effect of cooling rate on lead-free reflow soldering quality, and summarizes how the cooling rate effects the solder and the reliability of solder joints in SMT. It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
作者 徐波 王乐 史建卫 钱乙余
机构地区 哈尔滨工业大学现代焊接生产技术国家重点试验室 日东电子科技(深圳)有限公司
出处 《电子工业专用设备》 2005年第12期34-39,共6页 Equipment for Electronic Products Manufacturing
关键词 冷却速率 无铅钎料 回流炉 快速冷却 焊点可靠性 Cooling rate Lead-free solder Reflow oven Fast cooling Solder joint reliability
分类号 TG454 [金属学及工艺—焊接]
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参考文献9

  • 1Thomas Siewert. Database for Solder Properties with Emphasis on New Lead-free solders[EB/OL].http://www.boulder.nist.gov/div853/lead%20free/props01.pdf, February 11,2002.
  • 2F.Ochoa,J.J.Williams,N.Chawla. Effect of cooling rate on the microstructrue and tensile behavior of a Sn-3.5wt%Ag solder[EB/OL]. http://www.pb-free.com/pdf/university_ research/tensile_cooling.pdf, No. 12,2003.
  • 3K.S.Kim,S.H.Huh,K.Suganuma. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J].Materials Science and Engineering, 2002, (A333): 106-114.
  • 4X.Deng,G.Piotrowski,J.J.Williams and N.Chawla. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on grows and evolution during thermal aging of Sn-Ag solder/Cu joints[EB/OL].http://www.pb-free.com/pdf/university_ research/intermetallic.pdf, No. 12,2003.
  • 5J.Madeni,S.Liu,and T.Siewert,Casting of Lead-Free Solder Specimens with Various Solidification-Rates [EB/OL].http://www.boulder.nist.gov/div853/Publication% 20files/NIST_ASM Pb free casting.pdf,2001.
  • 6W.Yang, LE Felton,and RW Messler Jr, The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints [J].Journal of ELECTRONIC MATERIALS, 1995, 24 (10):1465-1472.
  • 7F.Ochoa,X.Deng,and N.Chawla. Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy [J].Journal of ELECTRONIC MATERIALS, 2000, 33(12): 1596-1601.
  • 8Ursula Marquez,Denis Barbini,The importance of cooling rate in reflow profiles [EB/OL].http://www.kester. com/enUS/leadfree/LFC/2004_v 1/LFC_2004_v 1.pdf. July,2004.
  • 9Y.Qi,A.R.Zbrzez,M.Aglar. Lam.Accelerated Thermal Fatigue of Lead- Free Solder Joints as a Function of Reflow Cooling Rate [J].Journal of ELECTRONIC MATERIALS,2000, 33(12): 1497-1503.
电子工业专用设备
2005年 第12期

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