平板型SOFC合金连接板的研究进展

Development of metallic interconnect materials for SOFCs

从材料设计和表面处理方面综述了合金材料作为连接板的研究近况。合金连接板具有高的电子传导和热传导性,成本低,加工性能优良,合金材料表面氧化膜生长速率适中。经过表面处理的合金,在工作过程中涂层与基体发生反应生成更抗氧化的保护层,面电阻率进一步降低,具有很好的应用前景。

The recent development of metallic interconnect materials is reviewed in detail from material design and surface treatment points. The metallic interconnects shows many advantages： high electrical and thermal conductivity,low cost, easy manufacture and good workability. Metallic material developed stable oxide scales with acceptable growth rate. The more oxidation resistance scales are developed after surface treatment and the area specific resistance decreased over the expected SOFC lifetime.