摘要
以一种甲氧基取代的新型含杂萘联苯结构的芳香二胺:2-(4-氨基苯基)-4-[3-甲氧基-4-(4-氨基苯氧基)苯基]-2,3-二氮杂萘-1-酮(OO-DA)为单体,采用Yamazaki体系,分别和3种芳香二酸进行溶液亲核缩聚反应,制得一类新型杂萘联苯型聚芳酰胺树脂,其特性粘度为0.89~1.03dL/g;以FT-IR、1H-NMR表征了聚合物的结构;利用DSC、TGA研究了聚合物的热性能,结果表明聚芳酰胺的玻璃化转变温度为281~307℃,氮气氛中5%热失重温度达440℃以上,800℃时残留质量>55%;在DMAC、NMP等极性非质子性溶剂中有良好的溶解性,所得聚酰胺膜的拉伸强度为69~93MPa,断裂伸长率8.65%~9.47%,拉伸模量1.49~1.78GPa,体积电阻率>1015Ω·cm.
A novel aromatic diamine, 2- (4-aminophenyl)-4-[3-methoxy-4- (4-aminophenoxy) phenyl]-2,3-phthalazin-l-one(OO-DA) ,polymerized with three aryl dicarboxylic acids to prepare a series of new aromatic polyamides by Yamazaki phthosphorylation method. The structure of polymers obtained was confirmed by FT-IR 1H-NMR,which were consistent with the designed structure. The synthesized polymers have a high inherent viscosities in the 0.89-1.03dl/g. They exhibit high glass transition temperature of 281-307℃ ,good thermosta bility with 5% mass loss temperature above 440℃ and more 55wt% residual mass at 800℃ in nitrogen atmosphere. All polyamides are readily soluble in polar solvents such as NMP, DMAc etc. The polyamide films have tensile strength 69-93MPa,tensile modulus 1.49-1.78GPa,elongation at break 8.65 %-9.47%. The volume electrical resistant coefficient are above 10^15Ω·cm.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2005年第12期1954-1956,共3页
Journal of Functional Materials
基金
国家高技术研究发展计划(863计划)资助项目(2003AA33g030)
关键词
聚芳酰胺
二氮杂萘酮
溶解性
耐热性
poly(aryl amides)
phthalazinone
solubility
thermostability