超薄铜箔在HDI的应用

Ultra Thin Copper for HDI Application

本文详细介绍了超薄铜箔的结构和制造方法，并对两种结构的超薄铜箔在HDI线路板的应用作了对比，研究了蚀刻速率和剥离强度特性以及图形电镀、激光钻孔的工艺，为超薄铜箔的实际应用提供了可靠的依据。

This article demonstrates the structure and manufacturing method of ultra thin copper that used E.D and rolled carrier copper foil, compared the application for HDI PCB, studied the etch rate and copper peel features, laser drill and pattern plating technologies, it provides the available data for ultra thin copper applications.