范德堡多晶硅热导率的测试结构

Van Der Pauw Test Structure of the Thermal Conductivity of Polysilicon Thin Films

在O.M.Paul等研究的范德堡热导率测试结构的基础上,提出了一种改进结构,利用一组测试结构来测得多晶硅薄膜的热导率。在十字型结构中一个含有多晶硅薄膜,而另一个不含有多晶硅薄膜,根据建立的热学模型,可以获取多晶硅薄膜的热导率。用有限元分析软件ANSYS进行了模拟分析,分析表明模拟值与实验值能较好地吻合,且辐射散热是基本可以忽略的,从而验证了模型建立的正确性,说明该方法能够实现对多晶硅薄膜的测量,且具有较高的测试精确度。

A micromachined thermal Van Der Pauw test structure is improved. Two structures to measure conductivity of polysilicon thin films are used. One cross-shaped layers consists of polysilicon thin films. The other cross-shaped layers has no polysilicon thin films. Making use of the difference between the structures, conductivity of polysilicon thin film can be measured. Thermal finite element simulations show that the radiative heat loss from the structure has a negligible effect on the extracted k value. Finite element software ANSYS is used to verify the structure design.