条形压电材料和弹性材料Ⅲ型界面裂纹分析

Analysis of the mode-Ⅲ interfacial crack between piezoelectric and elastic layers

采用Schm idt方法研究条形压电材料和弹性材料的界面Ⅲ型裂纹问题,主要探讨条形压电材料和弹性材料受反平面剪应力和平面电位移作用的情形;通过Fourier积分变换和界面裂纹位移差的车贝雪夫多项式假设,并利用Schm idt方法得到数值解,结果显示应力强度因子与材料厚度、裂纹尺寸及电位移有关。

The problem of the mode-Ⅲ interfacial crack between piezoelectric and elastic layers is analyzed using the Schmidt method. The situation that the layers are subjected to the antiplane shear stress and in-plane electric displacement is considered. Based on the Fourier integral transform and the Chebyshev polynomial assumption of interfacial crack displacement, the results are obtained by using the Schmidt method. The results show that the stress intensity factors of cracks depend on the geometry of the crack,the layer＇s thickness and the electric displacement.