金凸点键合工艺在国产陶瓷外壳中的应用

Gold Bump Bonding Process' s Application in Domestic Ceramics Packages

国产陶瓷外壳已经逐渐应用于高可靠要求的各类电子元器件的封装上。在IC封装过程中, 随着封装密度的提高,因其键合指状引线的质量难以满足键合工艺要求,为使其能达到工艺控制要求, 我们开发出一些相应的封装技术,提高了产品的可靠性。金凸点键合工艺用于提高国产陶瓷外壳键合指 上的键合引线强度有非常明显的效果,是一项较新的技术。

The domestic ceramics packages is gradual already applied in the each kind of electronics devices for high reliability. In the IC package process, along with increase of package density, because domestic ceramics packages＇s lead quality is not satisfy the wire bonding process＇s requirements, in order to make bond process be able to attain its control request, so we develop a some corresponding package＇s technique, enhance the reliability of product.Gold bump bonding process is used for raising bond wire＇ s pull strength in the domestic ceramics packages obtain very obvious result and it is a preferable newer technique.