QFN封装元件组装工艺技术的研究

The Research of OFN Soldering and Assembly

QFN(Quad Flat No-lead Package,方形扁平无引脚封装)是一种焊盘尺寸小、体积小、 以塑料作为密封材料的新兴表面贴装芯片封装技术。由于底部中央大暴露焊盘被焊接到PCB的散热焊 盘上,这使得QFN具有极佳的电和热性能。QFN封装尺寸较小,有许多专门的焊接注意事项。文章 介绍了QFN的特点、分类、工艺要点和返修。

The QFN package （ Quad Flat No-lead Package ）, a new and developing technology for chip package, is a small footprint, low profile, surface mount, plastic encapsulated package with leads on the bottom. QFN packages achieve maximum thermal and electrical performance only if the die pad is soldered the PCB thermal pad. Due to their small size, QFN packages have special soldering considerations, The things of QFN＇ s characteristics, division, technical gist and rework are described in this paper.