李宁成博士“无铅焊接—材料、工艺、解决问题和可靠性”学术讲座

前言：这一课程强调实施无铅焊接焊接的必备知识。包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。此外，还讨论失效模式，挑战和解决办法。

This course emphasizes on the technical knowledge required for implementing lead-free soldering. It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering. Furthermore it discusses the failure modes, challenges, and solutions for addressing those issues.