摘要
综述了高导热绝缘复合材料的导热机理和常用的导热理论模型,介绍了基体材料和填料的研究进展,复合技术的进展及其在电子、电机行业的应用前景。
The heal conduction mechanism and normally used theoretical models of high thermal conducting and electrical insulating composite are summnarized in the paper. The progress in the polymer material, filler and the fabricated techniques is introduced, otherwise, the prospect of such materials applied in electronic field and electromotor is presented and predicted
出处
《舰船电子工程》
2005年第6期36-40,共5页
Ship Electronic Engineering
关键词
高导热
绝缘
复合材料
应用
high thermal conductivity, electrical insulation composite,application.
