摘要
利用有限元方法,模拟分析了掺杂石墨/Cu钎焊接头残余应力的分布特征。分析结果表明,对接头有害的较大残余应力分布在石墨棱角距离焊缝约0.8mm处的狭小区域;降低连接温度、减少连接时间及增加钎焊压力均有利于减小接头残余应力,优化接头的界面应力状态;中间层的加入在一定程度上缓和了接头的残余应力。从缓和效果来看,Cu比Mo作中间层好,而Cu/Mo复合中间层的缓和效果最好,是较理想的中间层材料。
Distributions of residual stresses in doped graphite/Cu brazed joint are simulated and analysed by FEM calculation. Results show that destructive residual stresses distribute in the minute area adjacent to bond-line of graphite surface edge. Reducing bond temperature, diminishing bond time and increasing brazing pressure are in favor of the mollification of interface stresses. Stress can be relaxed to some extent by insetting interlayer. As to the mollification effect, the effect of Cu/Mo composite interlay is better than single Cu or Mo.
出处
《焊接技术》
北大核心
2005年第6期14-16,共3页
Welding Technology
