摘要
简要分析了白瓷双列直插外壳的失效模式和失效机理，并进行了模拟实验。通过对实验结果的分析，提出对成品微电路进行二次电镀能够提高其外壳的使用可靠性。
The failure mode and failure mechanism for white ceramic DIP's are analyzed,and experimental simulation is performed. It has been shown that the reliability of microcireuit packages can be improved by secondary electroplating.
出处
《微电子学》
CAS
CSCD
1996年第1期43-46,共4页
Microelectronics
关键词
集成电路
双列直插外壳
可靠性
Integrated circuit,Dual-in-line-package,Reliability
