改性有机硅/邻甲酚醛环氧树脂复合体系研究

Properties of Modified Polysiloxane/O-cresol Formaldehyde Epoxy Resin Composites

采用含氢硅油(H-PDMS)和烯丙基缩水甘油醚(AEP)在氯铂酸催化下,合成了带侧链环氧基的环氧化硅油(ES),并用ES及其改性物(PSA)来改性邻甲酚醛环氧树脂(ECN),制备出一系列可用于电子封装等具有高韧性、高耐热性等高性能环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率、吸水率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对改性材料性能的影响。结果表明:有机硅改性ECN后,其韧性和耐热性均有不同程度的提高。其中,环氧树脂经10份PSA改性后,增韧和耐热性均得到较大提高,其Tg达185.81℃,比纯ECN提高了21.33℃。

Side chains epoxy group polysiloxanes （ES） with different epoxy value were synthesized. And o-cresol formaldehyde epoxy resin （ECN） was modified by ES and their modifying agent （PSA）. And the aim was to obtain a series of epoxy basicmaterial with low water absorptivity, high toughness and thermal resistance used for electronic packaging, structural adhesive, andso on. The influence of modifying-method and the composing and the content of the organic silicon on the properties of the cured materials were investigated by mensurating their impact strength, tensile strength, elongation, glass transition temperature （Tg） and observing the morphology of fracture surfaces of the cured materials. And the water absorptivity was determined by hydrochloric acid-acetone method. The results showed that modified by 10 phr ES, especially 10 phr PSA, the toughness and thermal resistance of the cured materials were both improved, and the water absorptivity fell, which accordded with the modifying desire of electronic encapsulation materials and structural adhesive. At the same time, the thermal resistance of the latter was improved more remarkably, and its Tg reached 185.81℃, much higher than that of unmodified ECN.