摘要
Titanium nitride （TIN） films with nanostructure were prepared at ambient temperature on a （111） silicon substrate by the filtered cathodic arc plasma （FCAP） technology with an in-plane ＂S＂ filter. The effects of deposition parameters on the grain size, texture and nano-hardness of the films were systematically investigated. The grain size was obtained through calculation using the Scherrer formula and observed by TEM. The results of X-ray diffraction and electron diffraction indicated that increasing either negative substrate bias or argon flow promoted the formation of （111） preferred orientation. High argon flow leads to biaxial texture. The micro-hardness of the TIN films as a function of grain size showed a behavior according to the Hall-Petch relation under high argon flow.
Titanium nitride （TIN） films with nanostructure were prepared at ambient temperature on a （111） silicon substrate by the filtered cathodic arc plasma （FCAP） technology with an in-plane ＂S＂ filter. The effects of deposition parameters on the grain size, texture and nano-hardness of the films were systematically investigated. The grain size was obtained through calculation using the Scherrer formula and observed by TEM. The results of X-ray diffraction and electron diffraction indicated that increasing either negative substrate bias or argon flow promoted the formation of （111） preferred orientation. High argon flow leads to biaxial texture. The micro-hardness of the TIN films as a function of grain size showed a behavior according to the Hall-Petch relation under high argon flow.
基金
[This work was supported by the National Natural Science Foundation of China (No. 20571042) and the Natural Science Foundation of Henan University (No. 04YBRW056).]
