酒石酸钾钠和EDTA·2Na盐化学镀铜体系

Electroless copper plating system of potassium sodium tartrate and EDTA·2Na

研究了酒石酸钾钠(TART)和EDTA·2Na盐双络合化学镀铜体系中各因素对沉铜速度稳定性及镀层附着力的影响。实验结果表明化学镀铜速度随着络合剂酒石酸钾钠和EDTA·2Na盐浓度以及施镀时间的增加而减小,随着硫酸铜浓度、甲醛浓度、溶液pH值和反应温度的增加而增加;添加剂α,α′-联吡啶、亚铁氰化钾和PEG-1000对镀铜速度的影响较小,但对铜镀层外观质量影响较大。其化学镀铜最佳条件为CuSO4·5H2O质量浓度为16g/L,EDTA·2Na盐为21g/L,酒石酸钾钠为16g/L,甲醛为5.0g/L,亚铁氰化钾为70mg/L,α,α′-联吡啶为8mg/L,PEG-1000为1g/L,pH值为12.75,镀液温度为50℃。在最佳条件下,化学镀铜30min后所得镀层附着力良好、外观红亮且镀速达到3.4μm/h。由扫描电镜照片可见镀层表面平整、光滑、晶粒细致。

Electroless copper plating system of potassium sodium tartrate and EDTA · 2Na was investigated comprehensively. The results indicate that the copper deposition rate decreases with the increase of the concentration of potassium sodium tartrate and EDTA · 2Na and plating time, and increases with the increase of the concentration of CuSO4 · 5H2O and HCHO, pH value and reaction temperature. Although the influences of α, α＇-Dipyridyl, K4 [Fe（CN）6]· 3H2O and PEG-1000 additives on the deposition rate are small, those of these additives on the surface qualities of copper film are great. The optimal conditions of the electroless copper plating system are as follows： CuSO4 · 5H2O is 5.0 g/L, EDTA · 2Na is 21 g/L, potassium sodium tartrate is 5.0 g, HCHO is 16 ml/L, α, α＇-Dipyridyl is 8 mg/L, K4[-Fe（CN）6]· 3H2O is 70 mg/L, PEG-1000 is 1 g/L, pH value is 12.75, reaction temperature is 50 ℃. Plating for 30 min in the bath, the copper deposition rate reaches 3.4 μm/h. The SEM image demonstrates that the surface of copper film is smooth and fine.