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压铸镁合金AZ91D手机内构件的Ni-P化学镀 被引量:4

Electroless Plating of Ni-P on Mobile Telephone's Inner Component Made of Die-Cast AZ91D
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摘要 采用直接化学镀镍的方法,得到了光亮且均匀、致密的Ni-P镀层。在分析镀层形貌、化学成分和组织结构的基础上,测定了镀层厚度、硬度、结合力、阻抗及耐蚀性。结果表明:改进后的化学镀镍层与基体结合良好;硬度达479×9.8 MPa,400℃热处理后可提高至826X9.8 MPa;阻抗为0.4 Ω,且随热处理温度的提高呈下降趋势;镀层耐腐蚀性能良好,热处理后耐蚀性有所下降。 Electroless plating Ni-P on inner-component of mobile telephone was investigated, A bright, homogeneous and fine Ni-P coatings was obtained. Based on the analysis of coatings morphology, composition and structure, measured the thickness, hardness, adhesion force, impedance and corrosion resistance of the coatings. The conclusions are drawn as follows, the coatings which is improved has good adhesion force. And the hardness can reach 479 × 9.8 MPa, after heat-treatment at 400℃, its hardness can increase to 826 × 9.8 MPa; the impedance is 0.4Ω, its numerical value will drop following the ascent of heat-treatment temperatures; and corrosion resistance of coatings is good, after heat-treatment, its corrosion resistance will drop a little.
机构地区 太原理工大学
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2005年第12期1978-1981,共4页 Rare Metal Materials and Engineering
基金 山西省青年科学基金(20041023) 国家自然科学基金(50471070) 山西省自然科学基金(20051050)
关键词 镁合金 内构件 化学镀镍磷 耐蚀性 magnesium alloy inner-component electroless plating Ni-P corrosion resistance
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参考文献10

  • 1Gray J E,Luan B.Journal of Alloys and Compounds[J],2002,336:88.
  • 2Li Ying,Yu Gang.Surface Technology[J],2003,(32):1.
  • 3Rajan Ambat,Zhou W.Surface and Coating Technology[J],2004,179:124.
  • 4Sharma A K,Suresh M R.Metal Finishing[J],1998,3:10.
  • 5向阳辉,胡文彬,沈彬,赵昌正,丁文江.镁合金直接化学镀镍的初始沉积机制[J].上海交通大学学报,2000,34(12):1638-1640. 被引量:47
  • 6Rajan Ambat,Nating NaingAung.Corrosion Science[J],2000,42:1433.
  • 7Fairweather W A.Trans IMF[J],1997,75(3):113.
  • 8霍宏伟,李瑛,王福会.AZ91D镁合金化学镀镍[J].中国腐蚀与防护学报,2002,22(1):14-17. 被引量:82
  • 9LiNing(李宁).Application Technology of Electroless Plating [M].Beijing:Chemistry Industry Press,2003..
  • 10Guo Z,Keong K G,Sha W.Journal of Alloys and Compounds[J],2003,358:112.

二级参考文献11

  • 1王建祺 吴文辉 冯大明.国防工业出版社.电子能谱(XPS/XAES/UPS)引论[M].北京:国防工业出版社,1992.519.
  • 2[1]Delong H K. Plating on magnesium[J]. Metal Finishing Guidebook, 1978, 76(1):175~183.
  • 3[2]Dennis J K. Plating on magnesium alloy diecastings[J].Trans IMF, 1985, 63:74~80.
  • 4[3]Fairweather W A. Electroless nickel plating of magnesium[J].Trans IMF, 1997, 75(3) :113~117.
  • 5[4]Sharma A K. Electroless nickel plating on magnesium alloy[J]. Metal Finishing, 1998. (3):10~18.
  • 6[7]Wagner C D. Handbook of X-ray photoelectron spectroscopy [M]. Minnesota: Perkin-Elmer, 1979. 44.
  • 7[8]Pourbaix M. Atlas of electrochemical equilibria in aqueous solutions[M]. Houston: NACE. 1974. 140~145.
  • 8[9]Sakata Y. Electroless nickel plating directly on magnesium alloy diecastings[A]. In: The Proceedings of the 74 th AESF Annual Technical Conference [C ]. Orlando: AESF, 1987. 6.
  • 9曾小勤,王渠东,吕宜振,丁文江,朱燕萍.镁合金应用新进展[J].铸造,1998,47(11):39-43. 被引量:169
  • 10曾爱平,薛颖,钱宇峰,王志杰,黄元伟,陈英.镁合金的化学表面处理[J].腐蚀与防护,2000,21(2):55-56. 被引量:111

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