摘要
介绍了激光焊原理和有限元分析过程,建立了激光二极管封装组件的3-D有限元模型,利用A nsys有限元分析程序对激光二极管在不同焊接条件下激光焊封装的温度场进行了计算模拟,仿真分析了激光锤作用下激光二极管封装尾纤的焊后偏移(PW S)。在增加功率和脉冲时间的条件下,激光锤引起的焊后偏移量也相应的增加,但是在校正量相同的情况下,增加脉冲时间比增加功率对材料的热应力影响区要大。高功率低脉冲的焊接参数是完成焊接封装的首选参数。
Laser-welding theory and the analysing procedure of the finite element are introduced in this paper . 3-D finite element model of laser diode packaging components is built. Temperature field distribution and post-welding shift（PWS） of laser diode packaging are analysed by finite element method. The PWS increases with the increasing of power and pulse. But in the case of identical PWS, the range of influence of thermal stress by long pulse is larger than that by high power. High power and low pulse is the preferred welding-parameter in the process of welding packaging.
出处
《光电子技术》
CAS
2005年第4期239-243,共5页
Optoelectronic Technology
基金
国家自然科学基金重点资助项目(50235040)
关键词
激光二极管
有限元
激光焊
焊后偏移
laser diode
finite element
laser welding
post-welding shift
