摘要
采用静态热氧化和撇取表面膜的方法,研究了Sn-0.7Cu无铅焊料在使用温度下的氧化行为,并与Sn-37Pb进行了比较。结果显示:Sn-0.7Cu合金在高温下的氧化明显高于Sn-37Pb,液态合金表面氧化产渣量随撇渣频率的加快而增加。在恒温条件下,氧化渣的生成随时间的变化服从抛物线规律。指出Sn-0.7Cu合金与氧的亲和力大于Sn-37Pb,且表面氧化膜疏松,是造成氧化速度快的根本原因;提高表面膜的致密度,是降低氧化反应的根本措施。
The oxidation of Sn-0.7Cu was researched by static high temperature corrosive and the method of scrape off film on the liquid Sn-0.7Cu surface, and compared with the results of Sn-37Pb. The results indicate that the oxidation of Sn-0.7Cu is more than Sn-37Pb＇s obviously on same temperature. The amount of oxidation residue on liquid solder surface increase with the frequency of scrape off the residue. The relation of the change of oxidation residue with time accord with the parabola rule. It is the basic reason of increase oxidation that the appetency of Sn-0.7Cu with oxygen is larger than Sn-37Pb and the surface film is loose. Increasing the consistency of surface film is the basic measure of decreasing oxidation reaction.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第1期49-51,共3页
Electronic Components And Materials
基金
重庆市科委计划资助(渝科计字[2003]24号)
