摘要
在室温下,采用ECAP技术对纯铜进行了1～10道次的挤压,使其组织大大细化,得到了均匀、细小的等轴晶,平均晶粒尺寸为0.75μm。通过对不同ECAP道次后的退火试样的硬度测量和观察组织,结果表明:随ECAP道次的增加,开始再结晶的温度降低,再结晶软化的速率增加,ECAP8道次试样在433K发生静态再结晶。
Pure copper was processed by equal channel angular pressing（ECAP） for -10 passes at room temperature. Uniform and fine equiaxed grains with a grain size of 0.751μm were created.By measuring hardness and structure observation of anealing samples via different ECAP passes,the resultes show that the onset temperature of recrystallization drops and the sottening rate increases with the increase of ECAP passes.The static recrystallization occurs at 433K in the sample after 8 passes ECAP.
出处
《热加工工艺》
CSCD
北大核心
2005年第12期24-26,共3页
Hot Working Technology
基金
江苏科技大学青年基金资助项目(2004CL018J)
关键词
ECAP
纯铜
再结晶
ECAP
pure copper
recrystallization
