SiC粉体化学镀铜工艺研究

Study on technics of SiC composite powder electroless copper plating

介绍了SiC粉体的敏化、活化及其碱性化学镀铜的工艺配方.分别对镀液稳定性的影响因素和各工艺条件对镀速的影响进行了研究.结果表明,SiC粉体颗粒越细、镀液pH增大、温度升高,都容易导致镀液分解;增加甲醛含量,可以提高镀速,但是镀液稳定性下降;适宜的络合剂,可以提高镀层质量,保持镀液稳定,但络合剂含量增加,镀速降低.得出了最佳的工艺条件:φ(甲醛)10～20 mL/L,ρ(络合剂)50～70 g/L,温度15～35 ℃, pH 12.5 ～13.碱性化学镀铜后的SiC-Cu复合粉体及其于1 050 ℃热处理后的X-射线衍射分析表明,镀层中含Cu、SiC 和Cu2O,且Cu呈结晶态;铜镀层在高温下与SiC粉体能够较好共存,无脱落现象.扫描电镜照片显示,SiC-Cu复合粉体分散性良好,镀层表面平滑、均匀,并有细小的金属胞状颗粒随机堆积而成.

The process formula of sensitization, activation and alkaline electroless copper plating of SiC composite powder were introduced. Influential factors of bath stability and the influence of various process conditions on deposition rate were studied respectively. Results show that the baih is decomposed easily with the granule of SiC powder becoming finer and bath pH and temperature increasing. Deposition rate is increased but bath stability is decreased with increasing content of formaldehyde. Deposit quality is improved and bath stability is maintained with suitable content of complexant. But the deposition rate is decreased while increasing the content of complexant. The optimal process condition are as follows ： φ（formaldehyde） 10 - 20 mL/L,ρ（ complex-ant） 50-70 g/L, temperature of 15 -35℃, pH value of 12.5 - 13. X-ray diffraction analysis of composite powder of SiC-Cu after alkaline electroless copper plating and heat treatment at a temperature of 1050 ℃ show Cu, SiC and Cu2O existing in the deposit and Cu presenting a crystal state. Copper deposit is in good coexistence with SiC powder at high temperatures without falling off. SEM photo shows that the composite powder of SiC-Cu is dispersed. Its surface is smooth and even. Randomly piled up fine cystiform metal granules can be seen on the surface.