工程塑料表面化学镀金工艺

Process of electroless Au plating on engineering plastics

介绍了工程塑料表面两步法化学镀金工艺:先进行化学镀镍,然后利用镍和金的置换反应化学镀金.通过讨论温度、pH对镀层的影响,确定最佳微蚀液为双氧水与硫酸的体积比为1∶ 4的混合液,镀镍与镀金最佳温度都为85～90 ℃,最佳pH分别为4.7～4.9、4.4～4.8.说明了几点注意事项.实际应用表明,该镀金层结合力强,具有较好的机械强度与耐磨性,空隙小,表面均匀、光洁,金的纯度可达99.9%.提出了对塑料表面镀金工艺还需深入研究的几个方面.

A two-step eletroless Au plating process on the surface of engineering plastics was introduced. Following electroless nickel plating, electroless Au plating was realized by the displacement reaction of nickel with gold. The influences of microetch, temperature and pH on deposit were discussed, and hence some suitable process conditions were obtained as follows： an optimum microetch solution of a mixed solution with the volume ratio of hydrogen peroxide to sulfuric acid being 1 ： 4, an optimum temperature 85 - 90℃ and pH range 4.7 - 4.9 and 4.4 - 4.8 for eletroless nickel and gold plating respectively. Some notices were also given. Practical applications show that the gold deposit has advantages of good adhesion, mechanical strength and wear resistance, small interspace, uniform, bright and clean surface, a high gold purity of 99.9%. Some aspects that need to be deeply studied on electroless gold plating for engineering plastics were put forward.