摘要
采用特殊的活性焊料对CVD膜与硬质合金基体进行真空焊接,获得了大于500MPa的剪切强度,此强度已经接近金刚石膜的剪切强度。针对不同工艺的CVD刀具与PCD刀具对切削力和被加工材料表面粗糙度进行了切削试验对比,在铜材和硅铝合金的切割实验中CVD刀具达到的表面粗糙度达到表面粗糙度1.3μm和0.9μm,远高于使用PCD刀具获得的表面粗糙度2.9μm和1.4μm;结果表明CVD刀具较PCD刀具有明显的优势。
A self-developed special active solder （Ag 68.8 wt%, Cu 26.7% wt%, Ti 4.5 wt%） was used for vacuum brazing CVD diamond film to WC substrate. The thus made CVD cutting tool was tested. The shear strength of the interface was 500 MPa, which is nearly the same with that of CVD diamond film itself. Machining experiments were conducted with CVD film tool and PCD tool, and the results were compared. When cutting copper and Si-Al alloy seperately, the machined surface roughness can reach 1.31μm and 0.91μm, remarkably superior to 2.9μm and 1.4μm obtained with PCD tool under the same conditions. It is suggested that CVD cutting tool has a oromising future in reolacing natural diamond cutting tool.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2005年第6期31-33,37,共4页
Diamond & Abrasives Engineering
关键词
活性焊料
真空焊接
切削力
表面粗糙度
Active solder
vacuum brazing
cutting resistance
surface roughness
