摘要
改进钎焊技术需从钎焊工艺和焊料选择两方面入手。选用Ｓｎ／Ｐｂ比为６３／３７，且在惰性气体保护下铸造或轧制的焊料并采用抗氧化磷片调整焊锡的流动性是改进钎焊技术的有效途径。
Improvement of solder processes and correct choice of soldet are the necessary methods for the improvement of solder technology.A practical approach is to preparing,solder by casting or rolling the material of Sn/Pb(63/37) under the atmosphere of inert gas with additive of antioxygenic phosphorus for better fluidity.
出处
《电子元件与材料》
CAS
CSCD
1996年第2期30-32,共3页
Electronic Components And Materials
关键词
钎焊
焊料
抗氧化磷片
solder technology,choice of solder, antioxygenic phosphorous
