摘要
薄膜多层布线工艺，采用聚酰亚胺作介质，克服成膜后的“龟裂”、减少通孔的接触电阻和防止“断台”问题，是解决好介质质量的关键。
Polyimide is used as dielectric in the thick-film multi-layer technology to eliminating cracks and reducing the contact resistance of via holes and preventing print layers from bredking on critical points.
出处
《电子元件与材料》
CAS
CSCD
1996年第2期45-48,共4页
Electronic Components And Materials
关键词
薄膜电器
多层布线
布线
混合集成电路
thick-film HIC's,multi-layer layout,polyimide,via holes,film-formation process
