Cr对Cu—Ag—Cr合金再结晶行为的影响

Effects of Cr on the Recrystallization Behavior of Cu-Ag-Cr Alloy

采用真空熔炼方法制备了Cu—Ag和Cu—Ag—Cr合金，利用硬度测试、金相显微观察和透射电镜分析等方法，研究了Cr对Cu—Ag—Cr合金再结晶行为的影响。结果表明，微量Cr的加入，使合金中形成细小、弥散分布的析出相对位错和亚晶界具有强烈的钉扎作用，而有效抑制合金的再结晶，使Cu—Ag合金的再结晶软化温度提高150℃以上：同时还能显著细化合金的再结晶晶粒。

By means of a vacuum induction furnace, Cu-Ag-Cr and Cu-Ag alloy are produced. The influences of trace Cr addition on the recrystallization behavior of the Cu-Ag alloy have been studied by hardness measurement, optical microscope and transmission electron microscope observation. The result shows that the recrystallization wear restrained effectively with the trace addition of Cr, the recrystallization temperature of Cu-Ag alloy increases about 150℃, the increase is caused by the pinning effect of highly dispersed fine precipitates on dislocation and subgrain boundary, the trace addition of Cr could fine the recrystallization microstructure of the Cu-Ag alloys effectively.