高厚径比盲孔电镀

Plating High Aspect Ratio Blind Vias

盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。

Blind vias can vastly increase densities on panels, thereby reducing their size. It is described the technology of plating high aspect blind vias in this paper, especially of plating blind vias which sizes of 4 mils and above, utilizing different laser drilling, metallization and plating.