电子束能量、剂量对固化厚度影响的研究

Study of Effect of Electron Beam Energy and Dose on Curing Depth of Liquid Resists

在电子束液态曝光技术的可行性已被证实的基础上,采用理论和实验相结合的方法,就电子束能量和剂量对固化深度的影响进行了研究,以TMPTA和环氧618两种液体低聚物为抗蚀剂,得出了不同能量、不同剂量下的有效穿透深度曲线,以及两种抗蚀剂在能量为25 keV的电子束辐射下的临界剂量,固化出了十字形微结构。

Based on Electron Beam Liquid Lithography （EBLL）, the effect of the electron beam energy and dose on curing thickness is studied experimentally and theoretically. The curing depth curves of different energies and doses with TMPTA and Epoxy 618 liquid resists and the critical doses of the two resists under the 25 keV electron beam exposure are given. The curved cross mi- crostructure is also obtained.