电子元器件散热方法研究

Status of Techniques on Heat Dissipation in Electronic Components

随着电子器件的高频、高速以及集成电路技术的迅速发展和MEMS(MicroElectro-MechanicalSystem)技术的进步,电子元器件的总功率密度大幅度增长而物理尺寸却越来越小,热流密度也随之增加,所以高温的温度环境势必会影响电子元器件的性能,这就要求对其进行更加高效的热控制。因此,有效解决电子元器件的散热问题已成为当前电子元器件和电子设备制造的关键技术。本文针对电子元器件的散热与冷却问题,综述了当前应用研究中不同的散热和冷却方法,并进行了适当的分析。

With the rapid development of high frequency, high integration of electronic components and the integrated circuit technique, and the great improvement of MEMS, their power density are significantly increased, which leads to higher temperature environment affecting the performance of themselves. More effective heat control is required. Therefore, it is the key technique in the packing and fabricating process that effectively solving the problem of heat dissipation in electronic components. The paper summed up the principles and various cooling methods to eliminating temperature effects in the actual application.