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脉冲偏压电弧离子镀Ti/TiN纳米多层薄膜的结构与硬度 被引量:6

Microstructure and Hardness of Ti/TiN Nano-multilayer Films Deposited by Pulsed Bias Arc Ion Plating
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摘要 采用脉冲偏压电弧离子镀设备在高速钢基体上沉积Ti/TiN纳米多层硬质薄膜,通过仅改变偏压幅值的方法进行对比实验。XRD分析和薄膜断截面SEM形貌显示出薄膜的纳米多层组织结构;硬度测试表明纳米多层薄膜硬度随脉冲偏压升高而升高,在-900V时超过同等条件制备的TiN单层薄膜,硬度高达34.1GPa;分析表明硬度的提高主要与脉冲偏压工艺对薄膜组织的改善有关;用脉冲偏压电弧离子镀可以制备纳米多层硬质薄膜,并且在工艺控制上相对简单。 Ti/TiN nano-multilayer hard films were deposited using pulsed bias arc ion plating (PBAIP) on high-speed steel (HSS) substrates, and the microstructure and hardness of the films prepared by changing the magnitudes of pulsed bias were investigated. The results of XRD and SEM observation of cross-section morphology of films show that the films are nano-multilayer structure. The hardness values of the films increase with increasing pulsed bias magnitudes. At the bias of -900 V, the hardness value of the multilayer film reaches to 34.1 GPa, which is higher than that of TiN single layer film deposited with the same deposition parameter. The analysis shows that hardness enhance of the multilayer films is related to microstructure improvement of the films due to pulsed bias process. It can be concluded that PBAIP technique is available for depositing nano-multilayer hard films, and the process is quite simple to be controlled.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2005年第6期49-52,共4页 Transactions of Materials and Heat Treatment
基金 中国高技术研究发展(863)计划(2002AA302507)
关键词 脉冲偏压 电弧离子镀 Ti/TiN纳米多层 硬质薄膜 Film preparation Hardness Iron plating Nanostructured materials Titanium Titanium carbide
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参考文献15

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