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Study on Burn-In and Screening Method for 1 310 nm InGaAsP Laser Diodes

Study on Burn-In and Screening Method for 1 310 nm InGaAsP Laser Diodes
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摘要 The accelerating burn in and screening method of processing 1 310 nm InGaAsP of laser diodes (LDs) is introduced. It is confirmed that the theory of burn in and screening is based on the second derivative minimum of burn-in curve, and the new testing method has been given, that is automatic current control (ACC) burn-in and automatic power control (APC) testing. This avoidably bring the errors of testing in only ACC or APC method, which need to monitor and control or test LDs power change by photo-detector (PD) at high temperature, and LDs or PDs must be into the same environment (PD will be burn-in at the same time). Through the experiment, the accelerating burn-in and screening condition of the devices has been confirmed: ACC, 200 mA, 100 ℃, 8 h. This raise work efficiency 12 times than Bellcore standard and save testing fee. The accelerating burn in and screening method of processing 1 310 nm InGaAsP of laser diodes (LDs) is introduced. It is confirmed that the theory of burn in and screening is based on the second derivative minimum of burn-in curve, and the new testing method has been given, that is automatic current control (ACC) burn-in and automatic power control (APC) testing. This avoidably bring the errors of testing in only ACC or APC method, which need to monitor and control or test LDs power change by photo-detector (PD) at high temperature, and LDs or PDs must be into the same environment (PD will be burn-in at the same time). Through the experiment, the accelerating burn-in and screening condition of the devices has been confirmed: ACC, 200 mA, 100 ℃, 8 h. This raise work efficiency 12 times than Bellcore standard and save testing fee.
出处 《Journal of Beijing Institute of Technology》 EI CAS 2005年第4期373-377,共5页 北京理工大学学报(英文版)
关键词 laser diode burn-in and screening high temperature fast burn-in laser diode burn-in and screening high temperature fast burn-in
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参考文献10

  • 1Shi Jiawei,Jin Enshun,Li Hongyan,Ma Jing,Qi Liyun,Gao Dingsan.The characteristic junction parameter of a semiconductor laser and its relation with reliability[J].Optical and Quantum Electronics.1996(6)
  • 2Shi Jiawei,Jin Enshun,Gao Dingsan.The junction voltage saturation and reliability of semiconductor lasers[J].Optical and Quantum Electronics.1992(7)
  • 3Shi Jawei,Jin Enshun,Li Hongyan,et al.Effective method of evaluation of semiconductor lasers quality[].The Chinese Journal.1996
  • 4Michael C Y,Robert W H,Pierre M P.Degradation mechanisms of vertical cavity surface emitting lasers[].Quantum Electronics IEEE Journal.1996
  • 5Huang Dexiu,Liu Xuefeng.Semiconductor lasers and their applications[]..1999
  • 6Hwang Nara,Joo Gwan-Chong,Lee Sang-Hwan,et al.Structure-dependent reliability assessment of 1·3μmIn- GaAsP/InP uncooledlaser diodes by accelerated agingtest[]..1996
  • 7Magistrali F,Sala D,Sal mini G,et al.ESD-related la- tent failures of InGaAsP/InPlaser diodes for telecommu- nication equipments[]..1991
  • 8Paine B M,ThomasⅢ S,Delaney MJ.Low-tempera- ture, high-current lifetests on InP-based HBT’S[]..2001
  • 9Jiang Jianping.Semiconductor lasers[]..2000
  • 10Fritz WJ.Analysis of rapid degradation in high-power (AlGa) as laser diodes[].Quantum Electronics IEEE Journal.1990

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