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有机硅薄膜制备技术进展

Development in the preparation technique of the organosilicone film
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摘要 综述了有机硅薄膜制备技术中控制薄膜厚度、强度、孔径及其孔隙率的技术以及有关理论,阐述了提高薄膜强度及表面性能的微观改性技术,分析了成孔技术、制膜液组成与配比、添加剂种类、溶剂挥发时间、成膜环境(温度和湿度)、凝胶条件对薄膜孔径及其分布、孔隙率的影响,以及后处理对成品膜特性的影响。 The technology and theory of controlling the thickness, strength, pore and porosity of silicone film were summarized, and the microcosmic modification on how to improve the film strength and surface properties was studied. The factors which influencing the microstructure of the film such as the pores technology, the composition and ration of the pores, the type of addition, volatile time of the solvent, the temperature and humidity, the condition of gel to the film pore and its distribution, porosity and post treatment to the characteristics of the film were analyzed.
出处 《有机硅材料》 CAS 2006年第1期29-33,共5页 Silicone Material
关键词 有机硅 薄膜 厚度 强度 孔径 孔隙率 分离材料 silicone film, thickness, intensity, pores, porosity, final treatment
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