摘要
采用SIMOX和BESOI材料制作了CMOS倒相器电路,在25~200℃的不同温度下测量了PMOS和NMOS的亚阈特性曲线。实验结果显示,薄膜全耗SIMOX器件的阈值电压和泄漏电流随温度的变化小于厚膜BESOI器件。
CMOS inverter circuits were fabricated on SIMOX (Separation by Implantation of Oxygen) and BESOI (Bonding and Etch-back Silicon-on-Insulator) materials. The subthreshold characteristics of PMOS and NMOS were measured at different temperature points from room temperature to 200℃. Experiments show that the temperature dependence of the threshold voltage and the leakage current for thin film fully-depleted SIMOX devices were lower than that for thick film BESOI devices.
出处
《微电子学》
CAS
CSCD
1996年第3期146-149,共4页
Microelectronics