多芯片组件的布线

Routing Techniques for Multichip Modules

布线是多芯片组件（ＭＣＭ）ＣＡＤ中的一个关键步骤。由于ＭＣＭ的封装密度很高，因此，其布线问题也较传统的ＩＣ或ＰＣＢ布线更为困难。指出了ＭＣＭ布线中存在的问题。介绍了当前用于ＭＣＭ布线的几种方法，着重讨论了ＳＬＩＣＥ布线法和４通孔布线法。对这几种方法进行了比较。４通孔布线法可直接产生详细布线结果，有利于节省成本和提高布线效率。

Routing is a key procedure in the computer-aided-design of multi-chip modules (MCM's). Due to the high density of MCM packages, the routing for MCM's is much more difficult than that for tradiional IC's or PCB's. Problems with MCM routing are pointed out. Current techniques for MCM routing are described, with emphasis on SLICE routing and 4-via routing. It is demonstrated that the 4-via routing can generate detailed routing topologies, thus saving the cost and improving efficiency.