TiN涂层陶瓷刀具膜—基界面应力的试验研究

Experimental Study on Film-substrate Interfacial Stress of TiN Coated Ceramic Cutting Tool

利用X射线衍射(XRD)应力分析仪测试了TiN薄膜涂层与Si3N4陶瓷刀具基体的界面残余应力状况,分析了成膜过程中应力形成的原因及对膜—基结合强度的影响。结果表明,TiN薄膜的残余应力为压应力,本征应力为张应力,应力的大小及分布对涂层刀具的硬度和膜—基结合强度有明显影响。

The residual stress status on the interface of TiN film coating and Si3N4 ceramic cutting tool substrate is tested by X-ray diffraction （XRD） stress analyzer. The reason caused stress in the film forming process and the effects of stress on the filmsubstrate adhesion strength are analyzed. Results show that the residual stress in TiN film is compressive stress, the intrinsic stress is tensile stress, and values and distributions of the stress will affect obviously the hardness, the adhesion and bond strength of coated cutting tools.