纳米氧化硅在玻璃基片表面亚纳米级抛光中的应用

Sub-nanometer Precision Polishing of Glass Substrate with a Colloidal SiO_2 Slurry

为满足先进电子产品对玻璃基片表面超光滑的要求,制备了一种纳米氧化硅抛光液,并研究了氧化硅粒子大小、抛光时间等参数对玻璃基片抛光后表面粗糙度、材料去除速率的影响。ZYGO形貌仪表明,采用纳米氧化硅抛光液,可以使玻璃表面粗糙度达到0.5 nm左右。AFM表明,抛光后的玻璃基片表面超光滑且无划痕等微观缺陷。

To meet the requirement of many advanced electronic products to the ultra-smooth surface of glass substrates, a kind of slurry containing colloidal SiO2 particles was prepared. Then, the polishing tests of sodium-calcium glass substrate in the prepared slurry were conducted, and the effects of particle size and polishing duration on the average roughness of the polished surface as well as the material removal rate were studied. ZYGO profiler indicates that,with the prepared colloidal SiO2 slurry,the average roughness of the polished glass substrate surface can be decreased to about 0. 5 nm. AFM shows that an ultra-smooth polished surface is obtained, and micro-defects such as microscratches can hardly be observed.