摘要
针对光纤光栅温度传感器的交叉敏感问题,提出了一种光纤光栅温度传感器的铝盒封装工艺,并对铝盒封装光栅温度传感器的温度和应力特性进行了理论分析和实验研究。研究表明,该封装有效地减小了光纤光栅的应变灵敏性,并将光纤光栅的温度灵敏度提高到裸光栅的1.8倍。
Considering the bare optical fiber bragg grating being fragility and strain sensibility, an aluminum box encapsulating technique of fiber bragg temperature sensor（FBG）was developed. The comparison of encapsulated FBG and bare FBG indicated that the strain sensing property of FBG was much less than bare FBG, and the temperature sensing property of encapsulated FBG was 1.8 times as much as that of bare FBG.
出处
《传感器世界》
2005年第12期29-31,共3页
Sensor World
关键词
光纤光栅
温度传感器
应变敏感
封装
fiber bragg grating
temperature sensor
strain sensing
encapsulation
