摘要
综述了化学镀N i-P合金在电子工业中的应用现状,涉及电磁屏蔽、计算机存储、微电子等诸多领域。重点介绍了化学镀N i-P合金应用在手机外壳、计算机硬盘、晶片、印制电路板等典型实例。同时介绍了化学镀N i-P合金镀层在其它领域的广泛应用,并预测了其在电子工业中的应用前景。
Current status of application of electroless Ni P alloys in electronics industry involving the areas of electromagnetic shielding, computer storage, microelectronics was briefly reviewed. Some typical application examples in mobilephone shell, computer hard disk, wafer, printed circuit board were introduced. Widespread applications of eleetroless Ni-P alloys in other fields were also presented and their development prospect was previewed.
出处
《电镀与精饰》
CAS
2006年第1期30-34,52,共6页
Plating & Finishing
基金
上海科技发展基金(03525nm025和035211037)
