硅烷化和多聚赖氨酸化衬底结合容量的比较

Comparison of Binding Capability between Substrates Modified by Silanized Reagent and Polylysine

应用了多聚赖氨酸以及硅烷化试剂———3-氨丙基三乙氧基硅烷和3-(2,3环氧丙氧)丙基三甲氧基硅烷修饰硼玻璃衬底,并用微点阵点样仪和微通道在其上印刷微点阵。应用原子力显微镜观测以上所制备衬底的粗糙度以及荧光显微镜检测不同衬底的分子结合容量。结果显示:(1)多聚赖氨酸修饰衬底的粗糙度大于两种硅烷化试剂修饰衬底的粗糙度;(2)前者的结合容量高于硅烷化试剂修饰衬底的结合容量,多聚赖氨酸修饰衬底的探针结合容量是3-(2,3环氧丙氧)丙基三甲氧基硅烷修饰衬底的6倍,说明衬底的粗糙度和分子结合容量之间的正相关关系。

The substrates modified by polylysine （polylysine-substrate）, 3-aminopropyltriethoxylsilane （APTS-substrate） and 3＇-glyeidoxypropyhrimethoxysilane （GOPS-substrate） were imaged by atomic force microscope; the microarrays, which were printed by mierospotting device or microchannels on the modified substrates, were observed by fluorescence microscope. The data show that the roughness of surface modified by polylysine is higher than that modified by silanized reagents; also, the observations with fluorescence microscope show that the bounding capability of the polylysine-substrate is higher than that of the APTS-substrate and is six times as that of GOPS-substrate. The result indicates that the roughness and bounding capability are positively correlated.