摘要
提出超音波微换能组件封装设计制作方法,并以微制程技术发展主动式防尘机制,提供组件屏蔽保护、操作可靠度与适当之讯号连接。针对超音波微换能组件进行封装设计,包含微封盖结构、晶粒黏着制程及防尘机制,达到超音波微换能器较佳之讯号传输与防护效果。微封盖结构采用传输开孔设计,分析开孔面积对音波能量穿透率的影响;超音波讯号之传输与衰减特性仿真;晶粒黏着制程针对不同基板材料、尺寸与黏着层厚度仿真设计,评估封装结构制程条件与环境因素之应力效应;防尘机制设计不同型态之防尘电极,施加电压累积取样量测分析,结果显示对称分裂电极施加电压9V时,分析小于100μm微粒之附着减少率最大达68.6%。
The ultrasonic transducer＇s micropackaging with particle pollution restraint mechanisms using micromachining process is proposed. The developed packaging with active dustproof mechanisms is very promising, because it permits the advantages of shielding,protection, reliability and signal connection. Technical approaches to the capacitive microultrasonic transducer packaging are divided into three parts： micromachining cap structures, die attachments, and dustproof mechanisms. Simulations for handling the packaging issues are relatively developed. Features of the technology for restraint electrodes on microcap are described. The measurements for＇ various physical and electrical parameters and the packaging needed to make optimal measurements are given. The ratio of dust decrement is up to 68. 6% for split symmetrical electrodes, while the counted size of particles is smaller than 100um and applied voltage is fixed at 9V.
出处
《电子工业专用设备》
2006年第1期28-35,共8页
Equipment for Electronic Products Manufacturing
