摘要
3D封装是手机等便携式电子产品小型化和多功能化的必然产物。3D封装有两种形式,芯片堆叠和封装堆叠。文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
The 3D packaging is an inevitable outcome of small-sizize and multi-functionize for the cell phones and other portable electronic products. The 3D packaging can be achieved via chip stacking and package stacking. In this paper, the merits and demerits the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
出处
《电子与封装》
2006年第1期8-11,共4页
Electronics & Packaging
关键词
3D封装
芯片堆叠
封装堆叠
智能堆叠
3D packaging
Chip Stacking
Package Stacking
Smart Stacking
